Paper Title:
Mechanical and Electrical Properties of Co-Deposited and Multilayer Copper-Tungsten Films
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 163-165)
Edited by
E.J. Mittemeijer
Pages
551-558
DOI
10.4028/www.scientific.net/MSF.163-165.551
Citation
D.P. Monaghan, T. Hirst, D. Cross, R.D. Arnell, "Mechanical and Electrical Properties of Co-Deposited and Multilayer Copper-Tungsten Films ", Materials Science Forum, Vols. 163-165, pp. 551-558, 1994
Online since
May 1994
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.