Paper Title:
Investigation of the Behaviour of Stress in Metallization Thin Films for Microelectronics during Thermal Cycling using High-Temperature X-Ray Diffraction
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Periodical
Materials Science Forum (Volumes 166-169)
Edited by
R. Delhez and E.J. Mittemeijer
Pages
307-312
DOI
10.4028/www.scientific.net/MSF.166-169.307
Citation
G.M. Zorn, M. Schneegans, "Investigation of the Behaviour of Stress in Metallization Thin Films for Microelectronics during Thermal Cycling using High-Temperature X-Ray Diffraction", Materials Science Forum, Vols. 166-169, pp. 307-312, 1994
Online since
July 1994
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Price
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