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Interdiffusion in Pd/Cu Multilayered Film

Journal Materials Science Forum (Volumes 189 - 190)
Volume Interfaces II
Edited by B.C. Muddle
Pages 411-416
DOI 10.4028/www.scientific.net/MSF.189-190.411
Citation Y.P. Lee et al., 1995, Materials Science Forum, 189-190, 411
Authors Y.P. Lee, Insu Jeon, Jun Hwa Hong, J.H. Moon, J.I. Jeong, J.S. Kang
Keywords AES Depth Profiling, Interdiffusion, Pd/Cu Multilayered Film, Thermal Stability
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