Paper Title:
Measurements of Polishing-Induced Residual Damages in Silicon Wafers Using Noncontact Photoconductivity Amplitude Technique
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Periodical
Materials Science Forum (Volumes 196-201)
Edited by
M. Suezawa and H. Katayama-Yoshida
Pages
1813-1816
DOI
10.4028/www.scientific.net/MSF.196-201.1813
Citation
Y. Ogita, M. Nakano, H. Masumura, "Measurements of Polishing-Induced Residual Damages in Silicon Wafers Using Noncontact Photoconductivity Amplitude Technique", Materials Science Forum, Vols. 196-201, pp. 1813-1816, 1995
Online since
November 1995
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