Paper Title:
Subsurface Damage in Single Diamond Tool Machined SI Wafers
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 196-201)
Edited by
M. Suezawa and H. Katayama-Yoshida
Pages
1841-1846
DOI
10.4028/www.scientific.net/MSF.196-201.1841
Citation
T. Mchedlidze, I. Yonenaga, K. Sumino, "Subsurface Damage in Single Diamond Tool Machined SI Wafers", Materials Science Forum, Vols. 196-201, pp. 1841-1846, 1995
Online since
November 1995
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Price
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