Paper Title:
Interface Defects of Bonded Silicon Wafers
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 196-201)
Edited by
M. Suezawa and H. Katayama-Yoshida
Pages
1847-1852
DOI
10.4028/www.scientific.net/MSF.196-201.1847
Citation
M. Reiche, Q.-Y. Tong, U.M. Gösele, J. Heydenreich, "Interface Defects of Bonded Silicon Wafers", Materials Science Forum, Vols. 196-201, pp. 1847-1852, 1995
Online since
November 1995
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Price
$32.00
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