Paper Title:
Direct Bonding of Silicon Wafers with Grooved Surfaces: Characterization of Defects and Application to High Power Devices
  Abstract

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Periodical
Materials Science Forum (Volumes 196-201)
Edited by
M. Suezawa and H. Katayama-Yoshida
Pages
1853-1858
DOI
10.4028/www.scientific.net/MSF.196-201.1853
Citation
I. V. Grekhov, T.S. Argunova, M. Y. Gutkin, L.S. Kostina, T.V. Kudryavtzeva, "Direct Bonding of Silicon Wafers with Grooved Surfaces: Characterization of Defects and Application to High Power Devices", Materials Science Forum, Vols. 196-201, pp. 1853-1858, 1995
Online since
November 1995
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Price
$32.00
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