Formation of Slip Traces during Grain Growth of Thin Metal Sheets |
| Journal |
Materials Science Forum (Volumes 204 - 206) |
| Volume |
Grain Growth in Polycrystalline Materials II |
| Edited by |
H. Yoshinaga, T. Watanabe and N. Takahashi |
| Pages |
399-404 |
| DOI |
10.4028/www.scientific.net/MSF.204-206.399 |
| Citation |
H. Lin et al., 1996, Materials Science Forum, 204-206, 399 |
| Authors |
H. Lin, D.P. Pope |
| Keywords |
Cu, Grain Growth, Ni3Al, Nickel Ni, Plastic Deformation, Recrystallization RX, Residual Strains, Residual Stress, Slip Trace, Thermal Grooves, Thin Metal Sheets |
| Full Paper |
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