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A Direct Method for Density Matrix Calculation: Application to Si Grain Boundaries in the Tight-Binding Scheme

Journal Materials Science Forum (Volumes 207 - 209)
Volume Intergranular and Interphase Boundaries in Materials
Edited by A.C. Ferro, J.P. Conde and M.A. Fortes
Pages 105-108
DOI 10.4028/www.scientific.net/MSF.207-209.105
Citation A. Hairie et al., 1996, Materials Science Forum, 207-209, 105
Authors A. Hairie, F. Hairie, B. Lebouvier, E. Paumier
Keywords Bond Order, Density Matrix, Electronic Energy, Electronic Forces, Grain Boundary, Linear Scaling Order-N Method, Silicon, Tight-Binding
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