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Interface Diffusion under an Electric Field. Interface Evolution

Journal Materials Science Forum (Volumes 207 - 209)
Volume Intergranular and Interphase Boundaries in Materials
Edited by A.C. Ferro, J.P. Conde and M.A. Fortes
Pages 109-112
DOI 10.4028/www.scientific.net/MSF.207-209.109
Citation Leonid M. Klinger et al., 1996, Materials Science Forum, 207-209, 109
Authors Leonid M. Klinger, L. Levin, David J. Srolovitz
Keywords Electromigration, Interface Diffusion, Interface Instability
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