Paper Title:
Influence of Grain Boundary Structure on Bubble Formation Behaviour in Helium Implanted Copper
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 207-209)
Edited by
A.C. Ferro, J.P. Conde and M.A. Fortes
Pages
445-448
DOI
10.4028/www.scientific.net/MSF.207-209.445
Citation
P.A. Thorsen, J.B. Bilde-Sørensen, B. N. Singh, "Influence of Grain Boundary Structure on Bubble Formation Behaviour in Helium Implanted Copper", Materials Science Forum, Vols. 207-209, pp. 445-448, 1996
Online since
February 1996
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