Microstructures of Rapidly Solidified Cu-Hf Alloys
| Periodical | Materials Science Forum (Volumes 215 - 216) |
|---|---|
| Main Theme | Solidification and Gravity II |
| Edited by | A. Roósz and M. Rettenmayr |
| Pages | 51-58 |
| DOI | 10.4028/www.scientific.net/MSF.215-216.51 |
| Citation | B. Kuznicka et al., 1996, Materials Science Forum, 215-216, 51 |
| Authors | B. Kuznicka, K. Haimann, W. Dudzinski |
| Keywords | Age Hardening, Copper Alloy, Electrical Conductivity, Rapid Solidification |
| Price | US$ 28,- |