Paper Title:

Microstructures of Rapidly Solidified Cu-Hf Alloys

Periodical Materials Science Forum (Volumes 215 - 216)
Main Theme Solidification and Gravity II
Edited by A. Roósz and M. Rettenmayr
Pages 51-58
DOI 10.4028/www.scientific.net/MSF.215-216.51
Citation B. Kuznicka et al., 1996, Materials Science Forum, 215-216, 51
Authors B. Kuznicka, K. Haimann, W. Dudzinski
Keywords Age Hardening, Copper Alloy, Electrical Conductivity, Rapid Solidification
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