Paper Title:
Grain Size Analysis in Electrodeposited Cu-Coatings
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 228-231)
Edited by
R.J. Cernik, R. Delhez and E.J. Mittemeijer
Pages
457-462
DOI
10.4028/www.scientific.net/MSF.228-231.457
Citation
S. Schläfer, P. Klimanek, I. Handreg, G. Heinzel, G. Lanza, "Grain Size Analysis in Electrodeposited Cu-Coatings", Materials Science Forum, Vols. 228-231, pp. 457-462, 1996
Online since
July 1996
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Price
$32.00
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