Micromechanism of Time Dependent Deformation and Fracture of Silicon Carbide under High Temperature Condition |
| Journal |
Materials Science Forum (Volumes 233 - 234) |
| Volume |
Towards Innovation in Superplasticity I |
| Edited by |
T. Sakuma, T. Aizawa and K. Higashi |
| Pages |
109-116 |
| DOI |
10.4028/www.scientific.net/MSF.233-234.109 |
| Citation |
A.Toshimitsu Yokobori et al., 1996, Materials Science Forum, 233-234, 109 |
| Authors |
A.Toshimitsu Yokobori, Toyohiko Yano, T.E. Mitchell |
| Keywords |
Creep Ductility, Micromechanisms, Silicon Carbide (SiC), Void Formation |
| Full Paper |
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