Paper Title:
Punch-Through Behaviour of Wide Bandgap Materials (with Example in 6H-SiC) and its Benefit to JFETs
  Abstract

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Periodical
Materials Science Forum (Volumes 264-268)
Edited by
G. Pensl, H. Morkoç, B. Monemar and E. Janzén
Pages
1073-1076
DOI
10.4028/www.scientific.net/MSF.264-268.1073
Citation
N. Kaminski, S.T. Sheppard, E. Niemann, "Punch-Through Behaviour of Wide Bandgap Materials (with Example in 6H-SiC) and its Benefit to JFETs", Materials Science Forum, Vols. 264-268, pp. 1073-1076, 1998
Online since
February 1998
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Price
$32.00
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