Paper Title:
Fabrication of 3C-SiC on SiO2 Structures Using Wafer Bonding Techniques
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 264-268)
Edited by
G. Pensl, H. Morkoç, B. Monemar and E. Janzén
Pages
223-226
DOI
10.4028/www.scientific.net/MSF.264-268.223
Citation
C. A. Zorman, K.N. Vinod, A.A. Yasseen, M. Mehregany, "Fabrication of 3C-SiC on SiO2 Structures Using Wafer Bonding Techniques", Materials Science Forum, Vols. 264-268, pp. 223-226, 1998
Online since
February 1998
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Price
$32.00
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