Paper Title:
Crystal Texture and Electromigration Damage in Al-Based Interconnect Lines Studied by ACOM with the SEM
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 273-275)
Edited by
R.A. Schwarzer
Pages
573-580
DOI
10.4028/www.scientific.net/MSF.273-275.573
Citation
M. Lepper, A. von Glasow, D. Piscevic, R. A. Schwarzer, "Crystal Texture and Electromigration Damage in Al-Based Interconnect Lines Studied by ACOM with the SEM", Materials Science Forum, Vols. 273-275, pp. 573-580, 1998
Online since
February 1998
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.