Paper Title:
Copper Metallization of Submicron Trenches with Pulsed Vacuum Arc
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 287-288)
Edited by
Horst Hoffmann
Pages
239-242
DOI
10.4028/www.scientific.net/MSF.287-288.239
Citation
P. Siemroth, P. Wenzel, T. Witke, B. Schultrich, "Copper Metallization of Submicron Trenches with Pulsed Vacuum Arc", Materials Science Forum, Vols. 287-288, pp. 239-242, 1998
Online since
August 1998
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