Paper Title:
Investigation of Assemblies of Grain Boundary Dislocations in Nanostructured Copper by Computer Simulation
  Abstract

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Periodical
Materials Science Forum (Volumes 294-296)
Edited by
Pavel Lejcek and Václav Paidar
Pages
207-210
DOI
10.4028/www.scientific.net/MSF.294-296.207
Citation
I. V. Alexandrov, N. A. Enikeev, R. Valiev, "Investigation of Assemblies of Grain Boundary Dislocations in Nanostructured Copper by Computer Simulation", Materials Science Forum, Vols. 294-296, pp. 207-210, 1999
Online since
November 1998
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