Paper Title:

Nanoscopic Analysis of a Ag-Cu-Ti/Sapphire Brazed Interface

Periodical Materials Science Forum (Volumes 294 - 296)
Main Theme Intergranular and Interphase Boundaries in Materials
Edited by Pavel Lejcek and Václav Paidar
Pages 337-340
DOI 10.4028/www.scientific.net/MSF.294-296.337
Citation T. Ichimori et al., 1998, Materials Science Forum, 294-296, 337
Authors T. Ichimori, Chihiro Iwamoto, Shigeru Tanaka
Keywords Active Brazing, Interface Structure, Reaction Product, TEM, Ti-Free Phase
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