Paper Title:
Nanoscopic Analysis of a Ag-Cu-Ti/Sapphire Brazed Interface
| Periodical |
Materials Science Forum (Volumes 294 - 296)
|
| Main Theme |
Intergranular and Interphase Boundaries in Materials
|
| Edited by |
Pavel Lejcek and Václav Paidar |
| Pages |
337-340 |
| DOI |
10.4028/www.scientific.net/MSF.294-296.337 |
| Citation |
T. Ichimori et al., 1998, Materials Science Forum, 294-296, 337 |
| Authors |
T. Ichimori, Chihiro Iwamoto, Shigeru Tanaka |
| Keywords |
Active Brazing, Interface Structure, Reaction Product, TEM, Ti-Free Phase |
| Price |
US$ 28,- |