Paper Title:
Structure of Triple Line in Reactive Ag-Cu-Ti/SiC Wetting System
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 294-296)
Edited by
Pavel Lejcek and Václav Paidar
Pages
415-418
DOI
10.4028/www.scientific.net/MSF.294-296.415
Citation
M. Nomura, T. Ichimori, C. Iwamoto, S. Tanaka, "Structure of Triple Line in Reactive Ag-Cu-Ti/SiC Wetting System", Materials Science Forum, Vols. 294-296, pp. 415-418, 1999
Online since
November 1998
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Price
$32.00
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