Paper Title:
Grain-Boundary Diffusion of Bi in Cu Bicrystals
| Periodical |
Materials Science Forum (Volumes 294 - 296)
|
| Main Theme |
Intergranular and Interphase Boundaries in Materials
|
| Edited by |
Pavel Lejcek and Václav Paidar |
| Pages |
561-564 |
| DOI |
10.4028/www.scientific.net/MSF.294-296.561 |
| Citation |
R. Monzen et al., 1998, Materials Science Forum, 294-296, 561 |
| Authors |
R. Monzen, T. Okamoto |
| Keywords |
[001] Symmetric Tilt Boundary, [001] Twist Boundary, [011] Twist Boundary, Bi, Boundary Diffusion, Boundary Energy, Cu Bicrystal |
| Price |
US$ 28,- |