Paper Title:
Grain Boundary Modification During Long-Term Creep in Silicon Nitride
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 294-296)
Edited by
Pavel Lejcek and Václav Paidar
Pages
621-624
DOI
10.4028/www.scientific.net/MSF.294-296.621
Citation
F. Lofaj, H. Gu, A. Okada, H. Kawamoto, "Grain Boundary Modification During Long-Term Creep in Silicon Nitride", Materials Science Forum, Vols. 294-296, pp. 621-624, 1999
Online since
November 1998
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Price
$32.00
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