Microstructure, Conductivity and Hardness of Cu and Ag-Based Compacts with Immiscible Elements |
| Journal |
Materials Science Forum (Volume 307) |
| Volume |
Advances in Nanocrystallization |
| Edited by |
A.R. Yavari |
| Pages |
223-0 |
| DOI |
10.4028/www.scientific.net/MSF.307.223 |
| Citation |
K. Tousimi et al., 1999, Materials Science Forum, 307, 223 |
| Authors |
K. Tousimi, Alain Reza Yavari, Jung Ho Ahn, Andre Sulpice |
| Keywords |
Ag Matrix Composites, Ball Milling, Cu Matrix Composites, Electrical Resistivity, Scanning Electron Microscope (SEM), Strengthening Dispersion, TEM, Vickers Hardness, X-Ray Diffraction (XRD) |
| Full Paper |
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