Paper Title:
A Thermal Damage-Heat Conduction Coupled Model of Ceramic-Metal Functionally Graded Materials
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 308-311)
Edited by
W.A. Kaysser
Pages
1030-1034
DOI
10.4028/www.scientific.net/MSF.308-311.1030
Citation
Q. J. Zhang, P. C. Zhai, R. Z. Yuan, "A Thermal Damage-Heat Conduction Coupled Model of Ceramic-Metal Functionally Graded Materials", Materials Science Forum, Vols. 308-311, pp. 1030-1034, 1999
Online since
May 1999
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Price
$32.00
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