Paper Title:
Adhesion Enhancement of Covalent Thin Films by Parameter Graded Interface
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 308-311)
Edited by
W.A. Kaysser
Pages
219-225
DOI
10.4028/www.scientific.net/MSF.308-311.219
Citation
H. Leiste, M. Stüber, A. Kratzsch, S. Ulrich, H. Holleck, "Adhesion Enhancement of Covalent Thin Films by Parameter Graded Interface", Materials Science Forum, Vols. 308-311, pp. 219-225, 1999
Online since
May 1999
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Price
$32.00
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