Paper Title:
Analytical Modelling of Solidification during Temperature Gradient TLP Diffusion Bonding
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 329-330)
Edited by
A. Roósz, M. Rettenmayr, D. Watring
Pages
351-360
DOI
10.4028/www.scientific.net/MSF.329-330.351
Citation
A.A. Shirzadi, E.R. Wallach, "Analytical Modelling of Solidification during Temperature Gradient TLP Diffusion Bonding", Materials Science Forum, Vols. 329-330, pp. 351-360, 2000
Online since
January 2000
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Price
$32.00
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