Paper Title:
Application of Semi-Solid Forming to 2024 and 7075 Wrought Aluminum Billets Fabricated by the EMC Process
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 329-330)
Edited by
A. Roósz, M. Rettenmayr, D. Watring
Pages
487-492
DOI
10.4028/www.scientific.net/MSF.329-330.487
Citation
R.S. Rachmat, H. Takano, N. Ikeya, S. Kamado, Y. Kojima, "Application of Semi-Solid Forming to 2024 and 7075 Wrought Aluminum Billets Fabricated by the EMC Process", Materials Science Forum, Vols. 329-330, pp. 487-492, 2000
Online since
January 2000
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Price
$32.00
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