Paper Title:
The Application of the Solute Sweeping Model for Grain Boundary Liquation during Welding and Sub-Solidus Annealing of an Al-Cu Alloy
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 331-337)
Edited by
E.A. Starke, Jr., T.H. Sanders, Jr., W.A. Cassada
Pages
1113-1118
DOI
10.4028/www.scientific.net/MSF.331-337.1113
Citation
A. L. Wilson, R. P. Martukanitz, P. R. Howell, "The Application of the Solute Sweeping Model for Grain Boundary Liquation during Welding and Sub-Solidus Annealing of an Al-Cu Alloy", Materials Science Forum, Vols. 331-337, pp. 1113-1118, 2000
Online since
May 2000
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Price
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