Paper Title:
Liquid Infiltration and the Formation of Ternary Eutectic Mixtures at Grain Boundaries during Welding of Aluminum-Copper Alloys using Aluminum Silicon Filler Metal
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 331-337)
Edited by
E.A. Starke, Jr., T.H. Sanders, Jr., W.A. Cassada
Pages
1775-1780
DOI
10.4028/www.scientific.net/MSF.331-337.1775
Citation
A. L. Wilson, R. P. Martukanitz, P. R. Howell, "Liquid Infiltration and the Formation of Ternary Eutectic Mixtures at Grain Boundaries during Welding of Aluminum-Copper Alloys using Aluminum Silicon Filler Metal", Materials Science Forum, Vols. 331-337, pp. 1775-1780, 2000
Online since
May 2000
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Price
$35.00
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