Paper Title:
X-Ray Diffraction Determination of Residual Stresses in Narrow Copper Interconnects with Submicronic Widths
  Abstract

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Periodical
Materials Science Forum (Volumes 347-349)
Edited by
A.J. Böttger, R. Delhez and E.J. Mittemeijer
Pages
562-567
DOI
10.4028/www.scientific.net/MSF.347-349.562
Citation
O. Sicardy, I. Touet, L. Arnaud, F. Charlet, T. Berger, "X-Ray Diffraction Determination of Residual Stresses in Narrow Copper Interconnects with Submicronic Widths", Materials Science Forum, Vols. 347-349, pp. 562-567, 2000
Online since
May 2000
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