Paper Title:
Effects of Thermal Annealing on Cu/6H-SiC Schottky Properties
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 353-356)
Edited by
G. Pensl, D. Stephani and M. Hundhausen
Pages
615-618
DOI
10.4028/www.scientific.net/MSF.353-356.615
Citation
T. Hatayama, T. Suezaki, K. Kawahito, Y. Uraoka, T. Fuyuki, "Effects of Thermal Annealing on Cu/6H-SiC Schottky Properties", Materials Science Forum, Vols. 353-356, pp. 615-618, 2001
Online since
January 2001
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Price
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