Paper Title:
A Novel Technique for Shallow Angle Beveling of SiC to Prevent Surface Breakdown in Power Devices
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 353-356)
Edited by
G. Pensl, D. Stephani and M. Hundhausen
Pages
623-626
DOI
10.4028/www.scientific.net/MSF.353-356.623
Citation
J. N. Merrett, D. C. Sheridan, J. R. Williams, C. C. Tin, J.D. Cressler, "A Novel Technique for Shallow Angle Beveling of SiC to Prevent Surface Breakdown in Power Devices", Materials Science Forum, Vols. 353-356, pp. 623-626, 2001
Online since
January 2001
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Price
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