Paper Title:
Mechanism for Damage Healing of Cracked 6H-SiC Substrates by the Sublimation Method
  Abstract

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Periodical
Materials Science Forum (Volumes 353-356)
Edited by
G. Pensl, D. Stephani and M. Hundhausen
Pages
77-80
DOI
10.4028/www.scientific.net/MSF.353-356.77
Citation
T. Shimizu, T. Nishiguchi, M. Sasaki, S. Ohshima, S. Nishino, "Mechanism for Damage Healing of Cracked 6H-SiC Substrates by the Sublimation Method", Materials Science Forum, Vols. 353-356, pp. 77-80, 2001
Online since
January 2001
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