Paper Title:
Changes in Stress and Microstructure in Sputter Deposited Copper Films Due to Substrate Surface Effects
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 404-407)
Edited by
A.M. Dias, J. Pina, A.C. Batista and E. Diogo
Pages
691-696
DOI
10.4028/www.scientific.net/MSF.404-407.691
Citation
B. Okolo, P. Lamparter, U. Welzel, T. Wagner, E. J. Mittemeijer, "Changes in Stress and Microstructure in Sputter Deposited Copper Films Due to Substrate Surface Effects", Materials Science Forum, Vols. 404-407, pp. 691-696, 2002
Online since
August 2002
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