Paper Title:
Microstructure and Texture of Electrodeposited Cu on TiN Thin Films without a Cu Seed Layer
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 408-412)
Edited by
Dong Nyung Lee
Pages
1597-1602
DOI
10.4028/www.scientific.net/MSF.408-412.1597
Citation
I. Kim, I. S. Kim, S.-C. Hong, D. H. Kim, "Microstructure and Texture of Electrodeposited Cu on TiN Thin Films without a Cu Seed Layer", Materials Science Forum, Vols. 408-412, pp. 1597-1602, 2002
Online since
August 2002
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