Paper Title:
The Effect of Substrate Texture and Electroplating Conditions on the Texture and Surface Morphology of Copper Electrodeposits
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 408-412)
Edited by
Dong Nyung Lee
Pages
1609-1614
DOI
10.4028/www.scientific.net/MSF.408-412.1609
Citation
J. Y. Cho, J. A. Szpunar, "The Effect of Substrate Texture and Electroplating Conditions on the Texture and Surface Morphology of Copper Electrodeposits", Materials Science Forum, Vols. 408-412, pp. 1609-1614, 2002
Online since
August 2002
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Price
$32.00
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