Paper Title:
Texture Investigations In Damascene Copper Interconnects
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 408-412)
Edited by
Dong Nyung Lee
Pages
1627-1632
DOI
10.4028/www.scientific.net/MSF.408-412.1627
Citation
K. K. Mirpuri, J. A. Szpunar, K. J. Kozaczek, "Texture Investigations In Damascene Copper Interconnects", Materials Science Forum, Vols. 408-412, pp. 1627-1632, 2002
Online since
August 2002
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