Paper Title:
Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling
  Abstract

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Periodical
Materials Science Forum (Volumes 408-412)
Edited by
Dong Nyung Lee
Pages
1651-1656
DOI
10.4028/www.scientific.net/MSF.408-412.1651
Citation
S. J. Hwang, H. Park, J. H. Lee, K. H. Oh, Y. C. Joo, "Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling", Materials Science Forum, Vols. 408-412, pp. 1651-1656, 2002
Online since
August 2002
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Price
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