Paper Title:
Effects of Current Waveform and Bath Temperature on Surface Morphology and Texture of Copper Electrodeposits for ULSI
  Abstract

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Periodical
Materials Science Forum (Volumes 408-412)
Edited by
Dong Nyung Lee
Pages
1657-1662
DOI
10.4028/www.scientific.net/MSF.408-412.1657
Citation
H. J. Lee, D. N. Lee, "Effects of Current Waveform and Bath Temperature on Surface Morphology and Texture of Copper Electrodeposits for ULSI", Materials Science Forum, Vols. 408-412, pp. 1657-1662, 2002
Online since
August 2002
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Price
$35.00
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