Paper Title:
SELF-CON: A Self Consistent Software Package for Micromechanical Simulations
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 408-412)
Edited by
Dong Nyung Lee
Pages
341-346
DOI
10.4028/www.scientific.net/MSF.408-412.341
Citation
J. Signorelli, S. Freschi, P.A. Turner, R.E. Bolmaro, "SELF-CON: A Self Consistent Software Package for Micromechanical Simulations", Materials Science Forum, Vols. 408-412, pp. 341-346, 2002
Online since
August 2002
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Price
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