Paper Title:
Dynamic Recrystallization at Triple Junction during High-Temperature Deformation in Copper Tricrystal
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 408-412)
Edited by
Dong Nyung Lee
Pages
761-766
DOI
10.4028/www.scientific.net/MSF.408-412.761
Citation
S. Andiarwanto, H. Miura, T. Sakai, "Dynamic Recrystallization at Triple Junction during High-Temperature Deformation in Copper Tricrystal", Materials Science Forum, Vols. 408-412, pp. 761-766, 2002
Online since
August 2002
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