Texture Analysis of Copper Bonding Wire |
| Journal |
Materials Science Forum (Volumes 408 - 412) |
| Volume |
Textures of Materials - ICOTOM 13 |
| Edited by |
Dong Nyung Lee |
| Pages |
803-808 |
| DOI |
10.4028/www.scientific.net/MSF.408-412.803 |
| Citation |
Suk Min Baeck et al., 2002, Materials Science Forum, 408-412, 803 |
| Authors |
Suk Min Baeck, Kwang Kyun Park, Hunphil Ha, Young Joo Oh, Yong Jin Park, Jung Tak Moon, Jin Lee, Kyu Hwan Oh |
| Keywords |
Copper Bonding Wire, Electron Backscatter Diffraction (EBSD), Recrystallization RX, Texture |
| Full Paper |
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