Paper Title:
Texture Analysis of Copper Bonding Wire
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 408-412)
Edited by
Dong Nyung Lee
Pages
803-808
DOI
10.4028/www.scientific.net/MSF.408-412.803
Citation
S. M. Baeck, K. K. Park, H. Ha, Y. J. Oh, Y. J. Park, J. T. Moon, J. Lee, K. H. Oh, "Texture Analysis of Copper Bonding Wire", Materials Science Forum, Vols. 408-412, pp. 803-808, 2002
Online since
August 2002
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.