Paper Title:
Recrystallization Texture of a Copper Electrodeposit with the <111> and <110> Duplex Orientation
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Periodical
Materials Science Forum (Volumes 408-412)
Edited by
Dong Nyung Lee
Pages
895-900
DOI
10.4028/www.scientific.net/MSF.408-412.895
Citation
S. Y. Kang, D. N. Lee, "Recrystallization Texture of a Copper Electrodeposit with the <111> and <110> Duplex Orientation", Materials Science Forum, Vols. 408-412, pp. 895-900, 2002
Online since
August 2002
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