Paper Title:
Improvement of Diffusion Bonding Joint by Ar Ion Bombardment
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 423-425)
Edited by
Wei Pan, Jianghong Gong, Lianmeng Zhang and Lidong Chen
Pages
113-118
DOI
10.4028/www.scientific.net/MSF.423-425.113
Citation
A. Wang, O. Ohashi, M. Aoki, N. Yamaguchi, "Improvement of Diffusion Bonding Joint by Ar Ion Bombardment", Materials Science Forum, Vols. 423-425, pp. 113-118, 2003
Online since
May 2003
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Price
$32.00
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