Paper Title:
Thermal Stress Simulation in TiB2-Cu Functionally Graded Materials
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 423-425)
Edited by
Wei Pan, Jianghong Gong, Lianmeng Zhang and Lidong Chen
Pages
245-248
DOI
10.4028/www.scientific.net/MSF.423-425.245
Citation
X. B. Wang, X. H. Zhang, S. Y. Du, "Thermal Stress Simulation in TiB2-Cu Functionally Graded Materials", Materials Science Forum, Vols. 423-425, pp. 245-248, 2003
Online since
May 2003
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.