Paper Title:
Bonding of Copper to Aluminum Nitride Substrate Using Active Alloy Interlayer
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 423-425)
Edited by
Wei Pan, Jianghong Gong, Lianmeng Zhang and Lidong Chen
Pages
301-304
DOI
10.4028/www.scientific.net/MSF.423-425.301
Citation
S. Q. Bai, L. D. Chen, A. Yamamura, "Bonding of Copper to Aluminum Nitride Substrate Using Active Alloy Interlayer", Materials Science Forum, Vols. 423-425, pp. 301-304, 2003
Online since
May 2003
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Price
$32.00
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