Paper Title:
Design and Thermal Shock Performance of W/Cu Functionally Graded Material used as Plasma Facing Component
  Abstract

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Periodical
Materials Science Forum (Volumes 423-425)
Edited by
Wei Pan, Jianghong Gong, Lianmeng Zhang and Lidong Chen
Pages
49-54
DOI
10.4028/www.scientific.net/MSF.423-425.49
Citation
Y. H. Ling, X. D. Bai, C. C. Ge, "Design and Thermal Shock Performance of W/Cu Functionally Graded Material used as Plasma Facing Component", Materials Science Forum, Vols. 423-425, pp. 49-54, 2003
Online since
May 2003
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Price
$32.00
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