Design and Thermal Shock Performance of W/Cu Functionally Graded Material used as Plasma Facing Component |
| Journal |
Materials Science Forum (Volumes 423 - 425) |
| Volume |
Functionally Graded Materials VII |
| Edited by |
Wei Pan, Jianghong Gong, Lianmeng Zhang and Lidong Chen |
| Pages |
49-54 |
| DOI |
10.4028/www.scientific.net/MSF.423-425.49 |
| Citation |
Yun Han Ling et al., 2003, Materials Science Forum, 423-425, 49 |
| Online since |
May, 2003 |
| Authors |
Yun Han Ling, Xin De Bai, Chang Chun Ge |
| Keywords |
Finite Element Analysis (FEA), Plasma Facing Material, Thermal Stress, Tungsten |
| Full Paper |
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