Paper Title:
Cohesive Model for Thin Graded Film/Substrate Interfacial Cleavage Fracture
  Abstract

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Periodical
Materials Science Forum (Volumes 423-425)
Edited by
Wei Pan, Jianghong Gong, Lianmeng Zhang and Lidong Chen
Pages
651-658
DOI
10.4028/www.scientific.net/MSF.423-425.651
Citation
R. Li , S. W. Yu, "Cohesive Model for Thin Graded Film/Substrate Interfacial Cleavage Fracture", Materials Science Forum, Vols. 423-425, pp. 651-658, 2003
Online since
May 2003
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Price
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