Paper Title:
Transient and Residual Stresses in a Hollow Cylinder of Functionally Graded Materials
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 423-425)
Edited by
Wei Pan, Jianghong Gong, Lianmeng Zhang and Lidong Chen
Pages
665-670
DOI
10.4028/www.scientific.net/MSF.423-425.665
Citation
C. H. Chen, H. Awaji, "Transient and Residual Stresses in a Hollow Cylinder of Functionally Graded Materials", Materials Science Forum, Vols. 423-425, pp. 665-670, 2003
Online since
May 2003
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Price
$32.00
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